Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515038 | Electrical connection for chip scale packaging | Ming-Chih Yew, Fu-Jen Li, Chia-Jen Cheng, Hsiu-Mei Yu | 2016-12-06 |
| 9502323 | Method of forming encapsulated semiconductor device package | Wen-Yi Lin, Kuo-Chuan Liu, Cheng-Yi Hong, Ming-Chih Yew | 2016-11-22 |
| 9502387 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2016-11-22 |
| 9252076 | 3D packages and methods for forming the same | Ming-Chih Yew, Wen-Yi Lin, Fu-Jen Li, Kuo-Chuan Liu | 2016-02-02 |
| 9237647 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2016-01-12 |