Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502323 | Method of forming encapsulated semiconductor device package | Kuo-Chuan Liu, Po-Yao Lin, Cheng-Yi Hong, Ming-Chih Yew | 2016-11-22 |
| 9252076 | 3D packages and methods for forming the same | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2016-02-02 |