Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502323 | Method of forming encapsulated semiconductor device package | Wen-Yi Lin, Kuo-Chuan Liu, Po-Yao Lin, Ming-Chih Yew | 2016-11-22 |
CH
Cheng-Yi Hong
Overall (2016): #441,721 of 481,213Top 95%
1
Patents 2016