HY

Hsiu-Mei Yu

TSMC: 1 patents #1,374 of 2,623Top 55%
📍 Baoshan, TW: #165 of 483 inventorsTop 35%
Overall (2016): #376,714 of 481,213Top 80%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9515038 Electrical connection for chip scale packaging Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin, Chia-Jen Cheng 2016-12-06