Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484308 | Semiconductor device | Ming-Kai Liu, Chao-Wen Shih | 2016-11-01 |
| 9397056 | Semiconductor device having trench adjacent to receiving area and method of forming the same | Yen-Ping Wang, Chao-Wen Shih, Shih-Wei Liang, Tsung-Yuan Yu, Hao-Yi Tsai +2 more | 2016-07-19 |
| 9379076 | Semiconductor device and manufacturing method thereof | Chen-Chih Hsieh, Hao-Yi Tsai, Chao-Wen Shih, Tsung-Yuan Yu | 2016-06-28 |
| 9343385 | Semiconductor device comprising a chip substrate, a mold, and a buffer layer | Nien-Fang Wu, Chao-Wen Shih, Hao-Yi Tsai | 2016-05-17 |
| 9343415 | Copper post structure for wafer level chip scale package | Chao-Wen Shih, Chen-Chih Hsieh, Hao-Yi Tsai | 2016-05-17 |