Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379076 | Semiconductor device and manufacturing method thereof | Hao-Yi Tsai, Chao-Wen Shih, Yung-Ping Chiang, Tsung-Yuan Yu | 2016-06-28 |
| 9343415 | Copper post structure for wafer level chip scale package | Chao-Wen Shih, Yung-Ping Chiang, Hao-Yi Tsai | 2016-05-17 |