Issued Patents 2016
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530673 | Apparatus and method for self-aligning chip placement and leveling | Jui Hsieh Lai, Ying-Hao Kuo | 2016-12-27 |
| 9496196 | Packages and methods of manufacture thereof | Chen-Hua Yu | 2016-11-15 |
| 9488779 | Apparatus and method of forming laser chip package with waveguide for light coupling | Chun-Hao Tseng, Ying-Hao Kuo | 2016-11-08 |
| 9478475 | Apparatus and package structure of optical chip | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo | 2016-10-25 |
| 9423578 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Ying-Hao Kuo | 2016-08-23 |
| 9419156 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo | 2016-08-16 |
| 9373527 | Chip on package structure and method | Chen-Hua Yu, Der-Chyang Yeh, Jui-Pin Hung | 2016-06-21 |
| 9368375 | Apparatus and method for self-aligning chip placement and leveling | Jui Hsieh Lai, Ying-Hao Kuo | 2016-06-14 |
| 9293437 | Functional block stacked 3DIC and method of making same | Chen-Hua Yu, Chih-Hang Tung | 2016-03-22 |
| 9264569 | Optical scanner integrated with substrate method of making and method of using the same | Tien-Yu Huang, Ying-Hao Kuo | 2016-02-16 |
| 9244223 | Light coupling formation in a waveguide layer | Chun-Hao Tseng, Ying-Hao Kuo | 2016-01-26 |