Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9488779 | Apparatus and method of forming laser chip package with waveguide for light coupling | Ying-Hao Kuo, Kuo-Chung Yee | 2016-11-08 |
| 9490148 | Adhesion promoter apparatus and method | Ying-Hao Kuo, Kai-Feng Cheng, Hai-Ching Chen, Tien-I Bao | 2016-11-08 |
| 9478475 | Apparatus and package structure of optical chip | Wan-Yu Lee, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2016-10-25 |
| 9419156 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2016-08-16 |
| 9374515 | Electronic element supporting base and electronic device | I-Te Chen, Wei-Cheng Liu, Jia-Yuan Hsu, Jen-Cheng Lai, Cheng-Chieh Chuang +1 more | 2016-06-21 |
| 9244223 | Light coupling formation in a waveguide layer | Ying-Hao Kuo, Kuo-Chung Yee | 2016-01-26 |