Issued Patents 2016
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490148 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Ying-Hao Kuo, Kai-Feng Cheng, Tien-I Bao | 2016-11-08 |
| 9490133 | Etching apparatus | Wan-Yu Lee, Ying-Hao Kuo, Tien-I Bao | 2016-11-08 |
| 9484211 | Etchant and etching process | Wan-Yu Lee, Ying-Hao Kuo, Tien-I Bao | 2016-11-01 |
| 9478939 | Light coupling device and methods of forming same | Jui Hsieh Lai, Ying-Hao Kuo, Tien-I Bao | 2016-10-25 |
| 9460988 | Interconnect structures | Chen-Hua Yu, Tien-I Bao | 2016-10-04 |
| 9405063 | Integrated metal grating | Jui Hsieh Lai, Tien-I Bao, Ying-Hao Kuo | 2016-08-02 |
| 9373579 | Protecting layer in a semiconductor structure | Chi-Lin Teng, Tien-I Bao | 2016-06-21 |
| 9335473 | Package structure and methods of forming same | Jui Hsieh Lai, Ying-Hao Kuo, Tien-I Bao | 2016-05-10 |
| 9330989 | System and method for chemical-mechanical planarization of a metal layer | Yung-Hsu Wu, Shih-Kang Fu, Hsin-Chieh Yao, Hsiang-Huan Lee, Chung-Ju Lee +1 more | 2016-05-03 |
| 9318364 | Semiconductor device metallization systems and methods | Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Tung-Ching Tseng, Wen-Cheng Yang +3 more | 2016-04-19 |
| 9281263 | Interconnect structure including a continuous conductive body | Ming-Han Lee, Hsiang-Huan Lee, Tien-I Bao, Chi-Lin Teng | 2016-03-08 |
| 9275953 | Semiconductor integrated circuit and fabricating the same | Hsin-Yen Huang, Yu-Sheng Chang, Tien-I Bao | 2016-03-01 |
| 9230911 | Interconnect structure and method of forming the same | Cheng-Hsiung Tsai, Chung-Ju Lee, Tien-I Bao, Shau-Lin Shue | 2016-01-05 |