Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466525 | Interconnect structures comprising flexible buffer layers | Chao-Hsien Peng, Hsiang-Huan Lee, Shau-Lin Shue | 2016-10-11 |
| 9318364 | Semiconductor device metallization systems and methods | Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng +3 more | 2016-04-19 |
| 9275953 | Semiconductor integrated circuit and fabricating the same | Yu-Sheng Chang, Hai-Ching Chen, Tien-I Bao | 2016-03-01 |