Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466525 | Interconnect structures comprising flexible buffer layers | Hsin-Yen Huang, Hsiang-Huan Lee, Shau-Lin Shue | 2016-10-11 |
| 9385029 | Method for forming recess-free interconnect structure | Hsiang-Huan Lee, Shau-Lin Shue | 2016-07-05 |
| 9252049 | Method for forming interconnect structure that avoids via recess | Tsung-Min Huang, Hsiang-Huan Lee, Shau-Lin Shue | 2016-02-02 |