Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490136 | Method of forming trench cut | Chia-Tien Wu, Yung-Hsu Wu | 2016-11-08 |
| 9431297 | Method of forming an interconnect structure for a semiconductor device | Yung-Hsu Wu, Cheng-Hsiung Tsai, Chia-Tien Wu, Chung-Ju Lee, Yung-Sung Yen +4 more | 2016-08-30 |
| 9405201 | Lithography process using directed self assembly | — | 2016-08-02 |
| 9355865 | Semiconductor patterning | Cheng-Hsiung Tsai, Chung-Ju Lee, Tsung-Jung Tsai | 2016-05-31 |
| 9275953 | Semiconductor integrated circuit and fabricating the same | Hsin-Yen Huang, Hai-Ching Chen, Tien-I Bao | 2016-03-01 |
| 9230809 | Self-aligned double patterning | Chung-Ju Lee, Tien-I Bao | 2016-01-05 |