Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490136 | Method of forming trench cut | Yu-Sheng Chang, Yung-Hsu Wu | 2016-11-08 |
| 9431297 | Method of forming an interconnect structure for a semiconductor device | Yung-Hsu Wu, Cheng-Hsiung Tsai, Yu-Sheng Chang, Chung-Ju Lee, Yung-Sung Yen +4 more | 2016-08-30 |
| 9425089 | Conductive element structure and method | Tai-I Yang, Hsiang-Wei Liu, Hsiang-Huan Lee, Tien-Lu Lin | 2016-08-23 |
| 9418868 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Ta-Ching Yu, Kuei-Shun Chen +4 more | 2016-08-16 |
| 9412652 | Air gap forming techniques based on anodic alumina for interconnect structures | Tien-Lu Lin | 2016-08-09 |
| 9412649 | Method of fabricating semiconductor device | Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Ta-Ching Yu, Kuei-Shun Chen +4 more | 2016-08-09 |
| 9397045 | Structure and formation method of damascene structure | Tai-Yen Peng, Jye-Yen Cheng | 2016-07-19 |
| 9305837 | Semiconductor arrangement and formation thereof | Tien-Lu Lin, Shau-Lin Shue | 2016-04-05 |