Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496221 | Method for forming fuse pad and bond pad of integrated circuit | Marcus Yang, Chih-Hao Lin, Hong-Seng Shue, Ruei-Hung Jang | 2016-11-15 |
| 9425089 | Conductive element structure and method | Hsiang-Wei Liu, Chia-Tien Wu, Hsiang-Huan Lee, Tien-Lu Lin | 2016-08-23 |
| 9390965 | Air-gap forming techniques for interconnect structures | Cheng-Chi Chuang, Yung-Chih Wang, Tien-Lu Lin | 2016-07-12 |
| 9373544 | Semiconductor arrangement and formation thereof | Tien-Lu Lin, Wai-Yi Lien, Chih-Hao Wang, Jiun-Peng Wu | 2016-06-21 |
| 9349690 | Semiconductor arrangement and formation thereof | Yu-Chieh Liao, Cheng-Chi Chuang, Tien-Lu Lin, Yung-Hsu Wu | 2016-05-24 |
| 9269609 | Semiconductor isolation structure with air gaps in deep trenches | Hong-Seng Shue, Wei-Ding Wu, Ming-Tai Chung, Shao-Chi Yu | 2016-02-23 |