Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496221 | Method for forming fuse pad and bond pad of integrated circuit | Tai-I Yang, Marcus Yang, Chih-Hao Lin, Ruei-Hung Jang | 2016-11-15 |
| 9269609 | Semiconductor isolation structure with air gaps in deep trenches | Tai-I Yang, Wei-Ding Wu, Ming-Tai Chung, Shao-Chi Yu | 2016-02-23 |