Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496221 | Method for forming fuse pad and bond pad of integrated circuit | Tai-I Yang, Marcus Yang, Chih-Hao Lin, Hong-Seng Shue | 2016-11-15 |
| 9391113 | Image-sensor device structure and method of manufacturing | Cheng-Ming Chiu, Chun Yan Chen, Chyi-Tsong Ni | 2016-07-12 |