Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530737 | Semiconductor device and manufacturing method thereof | Shih-Kang Fu, Hsien-Chang Wu, Li-Lin Su, Shau-Lin Shue | 2016-12-27 |
| 9496170 | Interconnect having air gaps and polymer wrapped conductive lines | Shin-Yi Yang, Hsiang-Huan Lee, Hsi-Wen Tien, Shau-Lin Shue | 2016-11-15 |
| 9490205 | Integrated circuit interconnects and methods of making same | Cheng-Hsiung Tsai, Chung-Ju Lee, Tsung-Jung Tsai, Hsiang-Huan Lee | 2016-11-08 |
| 9484302 | Semiconductor devices and methods of manufacture thereof | Shin-Yi Yang, Hsiang-Huan Lee, Hsien-Chang Wu | 2016-11-01 |
| 9324608 | Method for via plating with seed layer | Shin-Yi Yang, Ching-Fu Yeh, Tz-Jun Kuo, Hsiang-Huan Lee | 2016-04-26 |
| 9318439 | Interconnect structure and manufacturing method thereof | Shin-Yi Yang, Hsi-Wen Tien, Hsiang-Huan Lee, Shau-Lin Shue | 2016-04-19 |
| 9318364 | Semiconductor device metallization systems and methods | Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng +3 more | 2016-04-19 |
| 9281263 | Interconnect structure including a continuous conductive body | Hai-Ching Chen, Hsiang-Huan Lee, Tien-I Bao, Chi-Lin Teng | 2016-03-08 |
| 9269668 | Interconnect having air gaps and polymer wrapped conductive lines | Shin-Yi Yang, Hsiang-Huan Lee, Hsi-Wen Tien, Shau-Lin Shue | 2016-02-23 |