HT

Hsi-Wen Tien

TSMC: 3 patents #677 of 2,623Top 30%
📍 Xinfeng, TW: #2 of 3 inventorsTop 70%
Overall (2016): #71,019 of 481,213Top 15%
3
Patents 2016

Issued Patents 2016

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9496170 Interconnect having air gaps and polymer wrapped conductive lines Shin-Yi Yang, Hsiang-Huan Lee, Ming-Han Lee, Shau-Lin Shue 2016-11-15
9318439 Interconnect structure and manufacturing method thereof Shin-Yi Yang, Ming-Han Lee, Hsiang-Huan Lee, Shau-Lin Shue 2016-04-19
9269668 Interconnect having air gaps and polymer wrapped conductive lines Shin-Yi Yang, Hsiang-Huan Lee, Ming-Han Lee, Shau-Lin Shue 2016-02-23