Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496170 | Interconnect having air gaps and polymer wrapped conductive lines | Hsiang-Huan Lee, Ming-Han Lee, Hsi-Wen Tien, Shau-Lin Shue | 2016-11-15 |
| 9484302 | Semiconductor devices and methods of manufacture thereof | Ming-Han Lee, Hsiang-Huan Lee, Hsien-Chang Wu | 2016-11-01 |
| 9324608 | Method for via plating with seed layer | Ching-Fu Yeh, Tz-Jun Kuo, Hsiang-Huan Lee, Ming-Han Lee | 2016-04-26 |
| 9318439 | Interconnect structure and manufacturing method thereof | Hsi-Wen Tien, Ming-Han Lee, Hsiang-Huan Lee, Shau-Lin Shue | 2016-04-19 |
| 9269668 | Interconnect having air gaps and polymer wrapped conductive lines | Hsiang-Huan Lee, Ming-Han Lee, Hsi-Wen Tien, Shau-Lin Shue | 2016-02-23 |