Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343356 | Back end of the line (BEOL) interconnect scheme | Chi-Liang Kuo, Hsiang-Huan Lee | 2016-05-17 |
| 9324608 | Method for via plating with seed layer | Shin-Yi Yang, Ching-Fu Yeh, Hsiang-Huan Lee, Ming-Han Lee | 2016-04-26 |