Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9498851 | Methods for forming apparatus for stud bump formation | Yeong-Jyh Lin, Chien Ling Hwang, Yi-Li Hsiao, Chung-Shi Liu, Mirng-Ji Lii +1 more | 2016-11-22 |
| 9484226 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2016-11-01 |
| 9236351 | Semiconductor wafer device | Bor-Ping Jang, Chien Ling Hwang, Yeong-Jyh Lin | 2016-01-12 |