Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9498851 | Methods for forming apparatus for stud bump formation | Hsin-Hung Liao, Chien Ling Hwang, Yi-Li Hsiao, Chung-Shi Liu, Mirng-Ji Lii +1 more | 2016-11-22 |
| 9484226 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Hsiao-Chung Liang, Chung-Shi Liu | 2016-11-01 |
| 9425179 | Chip packages and methods of manufacture thereof | Chien Ling Hwang, Pei-Hsuan Lee, Ying-Jui Huang, Chung-Shi Liu | 2016-08-23 |
| 9418953 | Packaging through pre-formed metal pins | Chen-Hua Yu, Chien Ling Hwang | 2016-08-16 |
| 9236351 | Semiconductor wafer device | Bor-Ping Jang, Chien Ling Hwang, Hsin-Hung Liao | 2016-01-12 |