Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484226 | Methods for controlling warpage in packaging | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2016-11-01 |
| 9236351 | Semiconductor wafer device | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin | 2016-01-12 |