Issued Patents 2016
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318429 | Integrated structure in wafer level package | Yu-Hsiang Hu, Hung-Jui Kuo | 2016-04-19 |
| 9312243 | Semiconductor packages | Meng-Tse Chen, Yi-Da Tsai, Xi Chen, Tao-Hua Lee, Wei-Yu Chen +1 more | 2016-04-12 |
| 9312214 | Semiconductor packages having polymer-containing substrates and methods of forming same | Meng-Tse Chen, Chih-Wei Lin, Chun-Cheng Lin, Wen-Hsiung Lu, Ming-Da Cheng | 2016-04-12 |
| 9299688 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-03-29 |
| 9287203 | Package-on-package structure and method of forming same | Chih-Wei Lin, Wen-Hsiung Lu, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng | 2016-03-15 |
| 9287171 | Method of making a conductive pillar bump with non-metal sidewall protection structure | Yi-Wen Wu, Cheng-Chung Lin, Chien Ling Hwang | 2016-03-15 |
| 9281288 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Chun-Cheng Lin, Ming-Da Cheng | 2016-03-08 |
| 9275965 | Copper pillar bump with cobalt-containing sidewall protection layer | Chien Ling Hwang, Zheng-Yi Lim | 2016-03-01 |
| 9269687 | Packaging methods and packaged semiconductor devices | Meng-Tse Chen, Wei-Hung Lin, Yu-Peng Tsai, Chun-Cheng Lin, Chih-Wei Lin +1 more | 2016-02-23 |
| 9263377 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Tsung-Ding Wang, Chen-Shien Chen, Jiun Yi Wu | 2016-02-16 |
| 9263839 | System and method for an improved fine pitch joint | Cheng-Ting Chen, Wen-Hsiung Lu, Ming-Da Cheng, Mirng-Ji Lii | 2016-02-16 |
| 9263412 | Packaging methods and packaged semiconductor devices | Wei-Hung Lin, Ming-Da Cheng, Wei-Yu Chen, Hsiu-Jen Lin, Kuei-Wei Huang | 2016-02-16 |
| 9263302 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo | 2016-02-16 |
| 9257333 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng | 2016-02-09 |
| 9257401 | Method of fabricating bump structure and bump structure | Chun-Lei Hsu, Ming-Che Ho, Ming-Da Cheng | 2016-02-09 |
| 9257321 | Singulation apparatus and method | Chun-Cheng Lin, Yu-Peng Tsai, Meng-Tse Chen, Ming-Da Cheng | 2016-02-09 |
| 9252135 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2016-02-02 |
| 9230935 | Package on package structure and method of manufacturing the same | Chun-Cheng Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng | 2016-01-05 |