Issued Patents 2004
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836017 | Protection of low-k ILD during damascene processing with thin liner | Christy Mei-Chu Woo, Steven C. Avanzino, John Sanchez, Suzette K. Pangrle | 2004-12-28 |
| 6835656 | Method of forming ultra-shallow junctions in a semiconductor wafer with a deposited silicon layer and in-situ anneal to reduce silicon consumption during salicidation | Paul R. Besser | 2004-12-28 |
| 6836398 | System and method of forming a passive layer by a CMP process | Ramkumar Subramanian, Jane V. Oglesby, Mark S. Chang, Sergey Lopatin, Angela T. Hui +3 more | 2004-12-28 |
| 6833581 | Structure and method for preventing process-induced UV radiation damage in a memory cell | Angela T. Hui, Ning Cheng, Jaeyong Park, Jean Y. Yang, Kouros Ghandehari +1 more | 2004-12-21 |
| 6830998 | Gate dielectric quality for replacement metal gate transistors | James Pan, Paul R. Besser, Christy Mei-Chu Woo, Jinsong Yin | 2004-12-14 |
| 6828199 | Monos device having buried metal silicide bit line | Jusuke Ogura, Mark T. Ramsbey, Arvind Halliyal, Zoran Krivokapic, Nicholas H. Tripisas | 2004-12-07 |
| 6818557 | Method of forming SiC capped copper interconnects with reduced hillock formation and improved electromigration resistance | Christine Hau-Riege, Steve Avanzino, Robert A. Huertas | 2004-11-16 |
| 6809402 | Reflowable-doped HDP film | Dawn Hopper, Atul Gupta, Tyagamohan Gottipati, John Caffall | 2004-10-26 |
| 6809043 | Multi-stage, low deposition rate PECVD oxide | Robert A. Huertas, Hieu Pham | 2004-10-26 |
| 6806165 | Isolation trench fill process | Dawn Hopper, Mark S. Chang | 2004-10-19 |
| 6803267 | Silicon containing material for patterning polymeric memory element | Ramkumar Subramanian, Christopher F. Lyons, Matthew S. Buynoski, Patrick K. Cheung, Angela T. Hui +5 more | 2004-10-12 |
| 6803265 | Liner for semiconductor memories and manufacturing method therefor | Arvind Halliyal, Tazrien Kamal, Hidehiko Shiraiwa, Rinji Sugino, Dawn Hopper +1 more | 2004-10-12 |
| 6797652 | Copper damascene with low-k capping layer and improved electromigration reliability | Jeremy I. Martin, Hartmut Ruelke | 2004-09-28 |
| 6797614 | Nickel alloy for SMOS process silicidation | Eric N. Paton, Paul R. Besser, Qi Xiang | 2004-09-28 |
| 6787458 | Polymer memory device formed in via opening | Nicholas H. Tripsas, Matthew S. Buynoski, Suzette K. Pangrle, Uzodinma Okoroanyanwu, Angela T. Hui +7 more | 2004-09-07 |
| 6787864 | Mosfets incorporating nickel germanosilicided gate and methods for their formation | Eric N. Paton, Qi Xiang, Paul R. Besser, Ming-Ren Lin, Haihong Wang | 2004-09-07 |
| 6784095 | Phosphine treatment of low dielectric constant materials in semiconductor device manufacturing | Suzette K. Pangrle, Dawn Hopper, Lu You | 2004-08-31 |
| 6773954 | Methods of forming passive layers in organic memory cells | Ramkumar Subramanian, Jane V. Oglesby, Sergey Lopatin, Mark S. Chang, Christopher F. Lyons +1 more | 2004-08-10 |
| 6774432 | UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL | Tazrien Kamal, Mark T. Ramsbey, Arvind Halliyal, Jaeyong Park, Ning Cheng +6 more | 2004-08-10 |
| 6770905 | Implantation for the formation of CuX layer in an organic memory device | Matthew S. Buynoski, Suzette K. Pangrle, Sergey Lopatin | 2004-08-03 |
| 6770523 | Method for semiconductor wafer planarization by CMP stop layer formation | Kashmir Sahota, Jeffrey P. Erhardt, Arvind Halliyal, Krishnashree Achuthan | 2004-08-03 |
| 6765254 | Structure and method for preventing UV radiation damage and increasing data retention in memory cells | Angela T. Hui, Ning Cheng, Jaeyong Park, Jean Y. Yang, Hidehiko Shiraiwa +3 more | 2004-07-20 |
| 6764898 | Implantation into high-K dielectric material after gate etch to facilitate removal | William G. En, Joong S. Jeon, Ming-Ren Lin | 2004-07-20 |
| 6764966 | Spacers with a graded dielectric constant for semiconductor devices having a high-K dielectric | William G. En, Arvind Halliyal, Ming-Ren Lin, Chih-Yuh Yang | 2004-07-20 |
| 6762454 | Stacked polysilicon layer for boron penetration inhibition | Effiong Ibok, Joong S. Jeon, Arvind Halliyal | 2004-07-13 |