Issued Patents 2004
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835655 | Method of implanting copper barrier material to improve electrical performance | Paul R. Besser, Matthew S. Buynoski | 2004-12-28 |
| 6836398 | System and method of forming a passive layer by a CMP process | Ramkumar Subramanian, Jane V. Oglesby, Minh Van Ngo, Mark S. Chang, Angela T. Hui +3 more | 2004-12-28 |
| 6815340 | Method of forming an electroless nucleation layer on a via bottom | Paul R. Besser, Matthew S. Buynoski, Pin-Chin Connie Wang | 2004-11-09 |
| 6811671 | Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed | Alexander H. Nickel, Joffre F. Bernard | 2004-11-02 |
| 6803267 | Silicon containing material for patterning polymeric memory element | Ramkumar Subramanian, Christopher F. Lyons, Matthew S. Buynoski, Patrick K. Cheung, Angela T. Hui +5 more | 2004-10-12 |
| 6787458 | Polymer memory device formed in via opening | Nicholas H. Tripsas, Matthew S. Buynoski, Suzette K. Pangrle, Uzodinma Okoroanyanwu, Angela T. Hui +7 more | 2004-09-07 |
| 6773954 | Methods of forming passive layers in organic memory cells | Ramkumar Subramanian, Jane V. Oglesby, Mark S. Chang, Christopher F. Lyons, James J. Xie +1 more | 2004-08-10 |
| 6770905 | Implantation for the formation of CuX layer in an organic memory device | Matthew S. Buynoski, Suzette K. Pangrle, Minh Van Ngo | 2004-08-03 |
| 6746971 | Method of forming copper sulfide for memory cell | Minh Van Ngo, Suzette K. Pangrle, Nicholas H. Tripsas, Hieu Pham | 2004-06-08 |
| 6724087 | Laminated conductive lines and methods of forming the same | Matthew S. Buynoski, Paul R. Besser, Lu You | 2004-04-20 |
| 6717236 | Method of reducing electromigration by forming an electroplated copper-zinc interconnect and a semiconductor device thereby formed | Alexander H. Nickel, Paul L. King | 2004-04-06 |
| 6703308 | Method of inserting alloy elements to reduce copper diffusion and bulk diffusion | Paul R. Besser, Matthew S. Buynoski, Alline F. Myers, Phin-Chin Connie Wang | 2004-03-09 |
| 6703307 | Method of implantation after copper seed deposition | Paul R. Besser, Matthew S. Buynoski | 2004-03-09 |
| 6689689 | Selective deposition process for allowing damascene-type Cu interconnect lines | Paul R. Besser, Darrell M. Erb | 2004-02-10 |
| 6686263 | Selective formation of top memory electrode by electroless formation of conductive materials | Minh Van Ngo | 2004-02-03 |