Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831003 | Continuous barrier for interconnect structure formed in porous dielectric material with minimized electromigration | Richard J. Huang, Pin-Chin Connie Wang | 2004-12-14 |
| 6768204 | Self-aligned conductive plugs in a semiconductor device | Todd P. Lukanc, Fei Wang | 2004-07-27 |
| 6756306 | Low temperature dielectric deposition to improve copper electromigration performance | Steven C. Avanzino | 2004-06-29 |
| 6756303 | Diffusion barrier and method for its production | Fei Wang | 2004-06-29 |
| 6727592 | Copper interconnect with improved barrier layer | Christy Mei-Chu Woo, John Sanchez, Amit P. Marathe | 2004-04-27 |
| 6717266 | Use of an alloying element to form a stable oxide layer on the surface of metal features | Amit P. Marathe | 2004-04-06 |
| 6689689 | Selective deposition process for allowing damascene-type Cu interconnect lines | Paul R. Besser, Sergey Lopatin | 2004-02-10 |