Issued Patents 2004
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825684 | Hot carrier oxide qualification method | Hyeon-Seag Kim, Nian Yang, Tien-Chun Yang | 2004-11-30 |
| 6822473 | Determination of permeability of layer material within interconnect | Christine Hau-Riege, Stefan Hau-Riege | 2004-11-23 |
| 6822437 | Interconnect test structure with slotted feeder lines to prevent stress-induced voids | Christine Hau-Riege, John Sanchez | 2004-11-23 |
| 6770847 | Method and system for Joule heating characterization | Huade Walter Yao, Van-Hung Pham | 2004-08-03 |
| 6762597 | Structure, system, and method for assessing electromigration permeability of layer material within interconnect | Christine Hau-Riege, Stefan Hau-Riege | 2004-07-13 |
| 6727592 | Copper interconnect with improved barrier layer | Christy Mei-Chu Woo, John Sanchez, Darrell M. Erb | 2004-04-27 |
| 6725433 | Method for assessing the reliability of interconnects | Christine Hau-Riege | 2004-04-20 |
| 6717266 | Use of an alloying element to form a stable oxide layer on the surface of metal features | Darrell M. Erb | 2004-04-06 |
| 6714037 | Methodology for an assessment of the degree of barrier permeability at via bottom during electromigration using dissimilar barrier thickness | Christine Hau-Riege | 2004-03-30 |
| 6710452 | Coherent diffusion barriers for integrated circuit interconnects | Pin-Chin Connie Wang, Matthew S. Buynoski, Suzette K. Pangrle | 2004-03-23 |
| 6706630 | Method for forming an alloyed metal conductive element of an integrated circuit | — | 2004-03-16 |