Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822473 | Determination of permeability of layer material within interconnect | Stefan Hau-Riege, Amit P. Marathe | 2004-11-23 |
| 6822437 | Interconnect test structure with slotted feeder lines to prevent stress-induced voids | John Sanchez, Amit P. Marathe | 2004-11-23 |
| 6818557 | Method of forming SiC capped copper interconnects with reduced hillock formation and improved electromigration resistance | Minh Van Ngo, Steve Avanzino, Robert A. Huertas | 2004-11-16 |
| 6768323 | System and method for determining location of extrusion in interconnect | Stefan Hau-Riege | 2004-07-27 |
| 6762597 | Structure, system, and method for assessing electromigration permeability of layer material within interconnect | Stefan Hau-Riege, Amit P. Marathe | 2004-07-13 |
| 6725433 | Method for assessing the reliability of interconnects | Amit P. Marathe | 2004-04-20 |
| 6714037 | Methodology for an assessment of the degree of barrier permeability at via bottom during electromigration using dissimilar barrier thickness | Amit P. Marathe | 2004-03-30 |