Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818557 | Method of forming SiC capped copper interconnects with reduced hillock formation and improved electromigration resistance | Minh Van Ngo, Christine Hau-Riege, Robert A. Huertas | 2004-11-16 |