Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833321 | Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability | R. Scott List | 2004-12-21 |
| 6822473 | Determination of permeability of layer material within interconnect | Christine Hau-Riege, Amit P. Marathe | 2004-11-23 |
| 6768323 | System and method for determining location of extrusion in interconnect | Christine Hau-Riege | 2004-07-27 |
| 6762597 | Structure, system, and method for assessing electromigration permeability of layer material within interconnect | Christine Hau-Riege, Amit P. Marathe | 2004-07-13 |
| 6717268 | Electromigration-reliability improvement of dual damascene interconnects | — | 2004-04-06 |