Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833321 | Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability | Stefan Hau-Riege | 2004-12-21 |
| 6790748 | Thinning techniques for wafer-to-wafer vertical stacks | Sarah Kim, Mauro J. Kobrinsky | 2004-09-14 |
| 6790780 | Fabrication of 3-D capacitor with dual damascene process | Sarah Kim, Bruce A. Block | 2004-09-14 |
| 6762076 | Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices | Sarah Kim, Scot Kellar | 2004-07-13 |