Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831003 | Continuous barrier for interconnect structure formed in porous dielectric material with minimized electromigration | Pin-Chin Connie Wang, Darrell M. Erb | 2004-12-14 |
| 6803313 | Method for forming a hardmask employing multiple independently formed layers of a pecvd material to reduce pinholes | Pei-Yuan Gao, Lu You | 2004-10-12 |
| 6689684 | Cu damascene interconnections using barrier/capping layer | Lu You, Fei Wang | 2004-02-10 |
| 6673684 | Use of diamond as a hard mask material | Philip A. Fisher, Cyrus E. Tabery | 2004-01-06 |