Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6773988 | Memory wordline spacer | Tazrien Kamal, Mark T. Ramsbey | 2004-08-10 |
| 6770523 | Method for semiconductor wafer planarization by CMP stop layer formation | Jeffrey P. Erhardt, Arvind Halliyal, Minh Van Ngo, Krishnashree Achuthan | 2004-08-03 |
| 6723605 | Method for manufacturing memory with high conductivity bitline and shallow trench isolation integration | Jeffrey P. Erhardt | 2004-04-20 |
| 6720264 | Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties | Diana M. Schonauer, Johannes Groschopf, Gerd Marxsen, Steven C. Avanzino | 2004-04-13 |
| 6699785 | Conductor abrasiveless chemical-mechanical polishing in integrated circuit interconnects | Kai Yang, Steven C. Avanzino | 2004-03-02 |