Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812076 | Dual silicon layer for chemical mechanical polishing planarization | Shibly S. Ahmed, Haihong Wang, Bin Yu | 2004-11-02 |
| 6770523 | Method for semiconductor wafer planarization by CMP stop layer formation | Kashmir Sahota, Jeffrey P. Erhardt, Arvind Halliyal, Minh Van Ngo | 2004-08-03 |
| 6756643 | Dual silicon layer for chemical mechanical polishing planarization | Shibly S. Ahmed, Haihong Wang, Bin Yu | 2004-06-29 |