Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6797652 | Copper damascene with low-k capping layer and improved electromigration reliability | Minh Van Ngo, Jeremy I. Martin | 2004-09-28 |
| 6720242 | Method of forming a substrate contact in a field effect transistor formed over a buried insulator layer | Gert Burbach, Frank Heinlein, Johannes Groschopf, Gotthard Jungnickel, Carsten Hartig | 2004-04-13 |