Issued Patents All Time
Showing 201–225 of 393 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553580 | Method of manufacturing semiconductor device | Harry-Hak-Lay Chuang | 2020-02-04 |
| 10535675 | High voltage CMOS with co-planar upper gate surfaces for embedded non-volatile memory | Harry-Hak-Lay Chuang, Ya-Chen Kao, Yi Hsien Lu | 2020-01-14 |
| 10516026 | Split gate memory device and method of fabricating the same | Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai | 2019-12-24 |
| 10515829 | Package system for integrated circuits | Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2019-12-24 |
| 10515977 | Boundary design to reduce memory array edge CMP dishing effect | Chien-Hung Chang | 2019-12-24 |
| 10510855 | Transistor layout to reduce kink effect | Meng-Han Lin, Te-Hsin Chiu | 2019-12-17 |
| 10510763 | Embedded nonvolatile memory and forming method thereof | Chang-Ming Wu, Yuan-Tai Tseng, Shih-Chang Liu, Chia-Shiung Tsai, Ru-Liang Lee +1 more | 2019-12-17 |
| 10510654 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh +1 more | 2019-12-17 |
| 10510674 | Fan-out package having a main die and a dummy die, and method of forming | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Hsien-Wei Chen | 2019-12-17 |
| 10504877 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh | 2019-12-10 |
| D868857 | Torch | — | 2019-12-03 |
| 10490460 | Semiconductor arrangement and method of forming | Harry-Hak-Lay Chuang, Chin-Yi Huang, Shih-Chang Liu | 2019-11-26 |
| 10475805 | Nitride-free spacer or oxide spacer for embedded flash memory | Jui-Tsung Lien | 2019-11-12 |
| 10475768 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-11-12 |
| 10468410 | Metal gate modulation to improve kink effect | Meng-Han Lin, Te-Hsin Chiu | 2019-11-05 |
| RE47709 | Forming grounded through-silicon vias in a semiconductor substrate | Chi-Chun Hsieh, Hsiao-Tsung Yen, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2019-11-05 |
| 10461036 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh | 2019-10-29 |
| D863910 | Hand-held tool | — | 2019-10-22 |
| 10453932 | Semiconductor structure for flash memory cells and method of making same | Ming Chyi Liu, Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai +1 more | 2019-10-22 |
| 10453813 | Contact pad for semiconductor device | Chang-Chia Huang, Tsung-Shu Lin, Cheng-Chieh Hsieh | 2019-10-22 |
| 10418361 | Circuit incorporating multiple gate stack compositions | Po-Nien Chen, Bao-Ru Young, Chi-Hsun Hsieh, Harry-Hak-Lay Chuang, Eric Huang | 2019-09-17 |
| D859109 | Soldering bit | — | 2019-09-10 |
| 10381358 | Semiconductor device and manufacturing method thereof | Jui-Tsung Lien | 2019-08-13 |
| 10373964 | Method of writing to memory circuit using resistive device | Yen-Huei Chen, Hung-Jen Liao, Chih-Yu Lin, Jonathan Tsung-Yung Chang | 2019-08-06 |
| 10354961 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Chien-Chia Chiu +1 more | 2019-07-16 |