Issued Patents All Time
Showing 176–200 of 393 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833030 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Tsung-Shu Lin | 2020-11-10 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2020-10-20 |
| 10811426 | NVM memory HKMG integration technology | Chien-Hung Chang | 2020-10-20 |
| 10811504 | Semiconductor structure for flash memory cells and method of making same | Ming Chyi Liu, Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai +1 more | 2020-10-20 |
| 10796947 | Method of manufacturing a semiconductor device | Jack Liu, Charles Chew-Yuen Young, Sing-Kai Huang | 2020-10-06 |
| 10784270 | Method to improve fill-in window for embedded memory | Meng-Han Lin, Te-Hsin Chiu | 2020-09-22 |
| 10783954 | Semiconductor memory with respective power voltages for memory cells | Chih-Yu Lin, Kao-Cheng Lin, Wei Min Chan, Yen-Huei Chen | 2020-09-22 |
| 10784207 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh | 2020-09-22 |
| D896027 | Baking plate | — | 2020-09-15 |
| 10748895 | Semiconductor arrangement and formation thereof | Harry-Hak-Lay Chuang, Shih-Chang Liu, Ming Chyi Liu | 2020-08-18 |
| 10741555 | Metal gate modulation to improve kink effect | Meng-Han Lin, Te-Hsin Chiu | 2020-08-11 |
| 10741569 | Semiconductor device and manufacturing method thereof | Chen-Chin Liu, Yi Hsien Lu, Yu-Hsiung Wang, Juo-Li Yang | 2020-08-11 |
| 10734295 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Shang-Yun Hou +1 more | 2020-08-04 |
| 10714426 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2020-07-14 |
| 10700045 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh | 2020-06-30 |
| 10692750 | Method for fabricating a semiconductor device | Harry-Hak-Lay Chuang, Bao-Ru Young, Meng-Fang Hsu, Kong-Pin Chang, Chia Ming Liang | 2020-06-23 |
| 10685704 | Static random access memory circuit | Wei Min Chan, Yen-Huei Chen, Hung-Jen Liao, Ping-Wei Wang | 2020-06-16 |
| 10672776 | Memory circuit having resistive device coupled with supply voltage line | Yen-Huei Chen, Hung-Jen Liao, Chih-Yu Lin, Jonathan Tsung-Yung Chang | 2020-06-02 |
| 10665600 | Memory devices and method of fabricating same | Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai | 2020-05-26 |
| 10665595 | Metal isolation testing in the context of memory cells | Te-Hsin Chiu, Meng-Han Lin | 2020-05-26 |
| 10663512 | Testing of semiconductor chips with microbumps | Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2020-05-26 |
| 10658373 | Method for manufacturing semiconductor device with metal gate memory device and metal gate logic device | Harry-Hak-Lay Chuang, Ya-Chen Kao | 2020-05-19 |
| 10650882 | Static random access memory with a supplementary driver circuit and method of controlling the same | Chih-Yu Lin, Kao-Cheng Lin, Yen-Huei Chen | 2020-05-12 |
| 10644013 | Cell boundary structure for embedded memory | Meng-Han Lin, Chih-Ren Hsieh, Chih-Pin Huang | 2020-05-05 |
| 10629537 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2020-04-21 |