Issued Patents All Time
Showing 226–250 of 393 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347649 | Nitride-free spacer or oxide spacer for embedded flash memory | Jui-Tsung Lien | 2019-07-09 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2019-07-09 |
| 10332882 | Semiconductor device having protective structure over shallow trench isolation region and fabricating method thereof | Harry-Hak-Lay Chuang | 2019-06-25 |
| 10325918 | Semiconductor device and manufacturing method thereof | Li-Feng Teng | 2019-06-18 |
| 10325919 | Mask design for embedded memory | Li-Feng Teng | 2019-06-18 |
| 10319683 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh | 2019-06-11 |
| 10319681 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-06-11 |
| 10290584 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-05-14 |
| 10283512 | Semiconductor device and manufacturing method thereof | Li-Feng Teng | 2019-05-07 |
| 10276587 | NVM memory HKMG integration technology | Chien-Hung Chang | 2019-04-30 |
| 10276588 | HKMG high voltage CMOS for embedded non-volatile memory | Harry-Hak-Lay Chuang, Ya-Chen Kao, Yi Hsien Lu | 2019-04-30 |
| 10269738 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Tsung-Shu Lin | 2019-04-23 |
| 10175294 | Testing of semiconductor chips with microbumps | Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2019-01-08 |
| 10176864 | Static random access memory circuits | Wei Min Chan, Yen-Huei Chen, Hung-Jen Liao, Ping-Wei Wang | 2019-01-08 |
| 10163802 | Fan-out package having a main die and a dummy die, and method of forming | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Hsien-Wei Chen | 2018-12-25 |
| 10163497 | Three dimensional dual-port bit cell and method of using same | Wei Min Chan, Yen-Huei Chen | 2018-12-25 |
| 10163522 | Test line letter for embedded non-volatile memory technology | Jui-Tsung Lien, Fang-Lan Chu, Hong-Da Lin, Ku-Ning Chang, Yu-Chen Wang | 2018-12-25 |
| 10163805 | Package structure and method for forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2018-12-25 |
| 10163919 | Embedded flash memory device with floating gate embedded in a substrate | Harry-Hak-Lay Chuang | 2018-12-25 |
| 10164074 | Semiconductor device with gate electrode embedded in substrate | Li-Feng Teng, Alexander Kalnitsky | 2018-12-25 |
| 10165682 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2018-12-25 |
| 10157825 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh +1 more | 2018-12-18 |
| 10157852 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh | 2018-12-18 |
| 10147794 | Split gate memory device and method of fabricating the same | Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai | 2018-12-04 |
| 10141288 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh | 2018-11-27 |