Issued Patents All Time
Showing 76–100 of 393 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688784 | Transistor layout to reduce kink effect | Meng-Han Lin, Te-Hsin Chiu | 2023-06-27 |
| 11680705 | Flame-resistant wick | — | 2023-06-20 |
| 11682593 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Shang-Yun Hou +1 more | 2023-06-20 |
| 11676660 | Static random access memory with a supplementary driver circuit and method of controlling the same | Chih-Yu Lin, Kao-Cheng Lin, Yen-Huei Chen | 2023-06-13 |
| 11672124 | High voltage CMOS with co-planar upper gate surfaces for embedded non-volatile memory | Harry-Hak-Lay Chuang, Ya-Chen Kao, Yi Hsien Lu | 2023-06-06 |
| 11664322 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh | 2023-05-30 |
| 11658224 | Split gate memory device and method of fabricating the same | Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai | 2023-05-23 |
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2023-05-16 |
| 11632491 | Methods and systems for identifying camera lens | — | 2023-04-18 |
| 11631682 | Metal isolation testing in the context of memory cells | Te-Hsin Chiu, Meng-Han Lin | 2023-04-18 |
| 11621248 | Bonded wafer device structure and methods for making the same | Harry-Hak-Lay Chuang, Wen-Tuo Huang | 2023-04-04 |
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2023-03-21 |
| 11610628 | Static random access memory | Hung-Jen Liao, Ping-Wei Wang, Wei Min Chan, Yen-Huei Chen | 2023-03-21 |
| 11603990 | Fuel-burning device | — | 2023-03-14 |
| 11600618 | Integrated circuit structure and manufacturing method thereof | Harry-Hak-Lay Chuang, Li-Feng Teng, Fang-Lan Chu, Ya-Chen Kao | 2023-03-07 |
| 11594620 | Semiconductor device and manufacturing method thereof | Li-Feng Teng | 2023-02-28 |
| 11587887 | Semiconductor device and manufacturing method thereof | Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Chih-Wei Lin +2 more | 2023-02-21 |
| 11581268 | Semiconductor package with redistribution structure and manufacturing method thereof | Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2023-02-14 |
| 11532621 | Metal gate modulation to improve kink effect | Meng-Han Lin, Te-Hsin Chiu | 2022-12-20 |
| 11532694 | Semiconductor device having capacitor and manufacturing method thereof | Meng-Han Lin, Te-Hsin Chiu, Te-An Chen | 2022-12-20 |
| 11527502 | Contact pad for semiconductor device | Chang-Chia Huang, Tsung-Shu Lin, Cheng-Chieh Hsieh | 2022-12-13 |
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh +3 more | 2022-11-29 |
| 11508695 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2022-11-22 |
| 11488971 | Embedded memory with improved fill-in window | Meng-Han Lin, Te-Hsin Chiu | 2022-11-01 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2022-10-11 |