WW

Wei-Cheng Wu

TSMC: 338 patents #29 of 12,232Top 1%
PI Pro-Iroda Industries: 24 patents #2 of 16Top 15%
PI Pro-Lroda Industries: 4 patents #1 of 2Top 50%
NU National Tsing Hua University: 4 patents #124 of 2,036Top 7%
DE Dupont Electronics: 3 patents #21 of 125Top 20%
UM United Microelectronics: 3 patents #1,523 of 4,560Top 35%
NU National Chiao Tung University: 3 patents #170 of 1,517Top 15%
Micron: 2 patents #3,728 of 6,345Top 60%
ZC Zhejiang Dahua Technology Co.: 2 patents #67 of 274Top 25%
AO Au Optronics: 2 patents #1,286 of 2,945Top 45%
MC Msi Computer (Shenzhen) Co.: 1 patents #30 of 93Top 35%
II Institute For Information Industry: 1 patents #327 of 904Top 40%
SC Scienbizip Consulting(Shenzhen)Co.: 1 patents #44 of 236Top 20%
Foxconn: 1 patents #3,106 of 5,504Top 60%
GC Goldtek Technology Co.: 1 patents #7 of 26Top 30%
NC Nanning Fugui Precision Industrial Co.: 1 patents #70 of 173Top 45%
PE Phison Electronics: 1 patents #172 of 344Top 50%
📍 Hsinchu, DE: #1 of 6 inventorsTop 20%
Overall (All Time): #668 of 4,157,543Top 1%
393
Patents All Time

Issued Patents All Time

Showing 26–50 of 393 patents

Patent #TitleCo-InventorsDate
12191282 Shared pad/bridge layout for a 3D IC Harry-Hak-Lay Chuang, Wen-Tuo Huang, Chia-Sheng Lin, Wei Chuang Wu, Shih Kuang Yang +5 more 2025-01-07
12191239 Stacked via structure disposed on a conductive pillar of a semiconductor die Che-Yu Yeh, Tsung-Shu Lin, Tsung-Yu Chen, Li-Han Hsu, Chien-Fu Tseng 2025-01-07
12176026 Static random access memory with a supplementary driver circuit and method of controlling the same Chih-Yu Lin, Kao-Cheng Lin, Yen-Huei Chen 2024-12-24
12176299 Semiconductor device and manufacturing method thereof Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Chih-Wei Lin +2 more 2024-12-24
12167594 Semiconductor device and manufacturing method thereof Chen-Chin Liu, Yi Hsien Lu, Yu-Hsiung Wang, Juo-Li Yang 2024-12-10
12136627 3DIC structure for high voltage device on a SOI substrate Harry-Hak-Lay Chuang, Wen-Tuo Huang, Hsin Fu Lin 2024-11-05
12127399 Array boundary structure to reduce dishing Meng-Han Lin, Te-Hsin Chiu, Li-Feng Teng, Chien-Hung Chang 2024-10-22
12115291 Electric heating fragrance diffuser 2024-10-15
D1046266 Combined wick and wick holder 2024-10-08
12107001 Semiconductor feature and method for manufacturing the same Harry-Hak-Lay Chuang, Chung-Jen Huang, Wen-Tuo Huang 2024-10-01
D1044053 Combined wick and wick holder 2024-09-24
D1044052 Combined wick and wick holder 2024-09-24
12096621 Multi-type high voltage devices fabrication for embedded memory Li-Feng Teng 2024-09-17
12087809 Semiconductor device having capacitor and manufacturing method thereof Meng-Han Lin, Te-Hsin Chiu, Te-An Chen 2024-09-10
12068313 Semiconductor arrangement and formation thereof Harry-Hak-Lay Chuang, Shih-Chang Liu, Ming Chyi Liu 2024-08-20
12058856 Semiconductor device and manufacturing method thereof Li-Feng Teng 2024-08-06
12048163 Trench gate high voltage transistor for embedded memory Alexander Kalnitsky, Chien-Hung Chang 2024-07-23
12028598 Methods and systems for identifying camera lens 2024-07-02
12015029 Method to embed planar FETs with finFETs Harry-Hak-Lay Chuang, Li-Feng Teng, Li-Jung Liu 2024-06-18
12009402 Method of forming a gate structure in high-κ metal gate technology Alexander Kalnitsky, Shih-Hao Lo, Hung-Pin Ko 2024-06-11
11978740 Semiconductor-on-insulator (SOI) semiconductor structures including a high-k dielectric layer and methods of manufacturing the same Harry-Hak-Lay Chuang, Kuo-Ching Huang, Hsin Fu Lin, Henry Wang, Chien-Hung Liu +2 more 2024-05-07
11967563 Fan-out package having a main die and a dummy die Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Hsien-Wei Chen 2024-04-23
11961826 Bonded wafer device structure and methods for making the same Harry-Hak-Lay Chuang, Wen-Tuo Huang 2024-04-16
11955439 Semiconductor package with redistribution structure and manufacturing method thereof Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin 2024-04-09
D1019311 Soldering tool 2024-03-26