Issued Patents All Time
Showing 151–175 of 337 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6740567 | Laminating method for forming integrated circuit microelectronic fabrication | Mong-Song Liang | 2004-05-25 |
| 6736701 | Eliminate broken line damage of copper after CMP | Shau-Lin Shue, Ying-Ho Chen, Wen-Chih Chiou, Tsu Shih | 2004-05-18 |
| 6734101 | Solution to the problem of copper hillocks | Tien-I Bao, Jeng Shwang-Ming, Chen-Hua Yu, Kuen-Chyr Lee | 2004-05-11 |
| 6734079 | Microelectronic fabrication having sidewall passivated microelectronic capacitor structure fabricated therein | Chi-Feng Huang, Shyh-Chyi Wang, Chih-Hsien Lin, Chun-Hon Chen, Tien-I Bao | 2004-05-11 |
| 6734110 | Damascene method employing composite etch stop layer | Chung-Shi Liu, Chen-Hua Yu | 2004-05-11 |
| 6729935 | Method and system for in-situ monitoring of mixing ratio of high selectivity slurry | Shang-Ting Tsai, Ping Chuang, Henry Lo, Chao-Jung Chang, Ping-Hsu Chen +3 more | 2004-05-04 |
| 6727172 | Process to reduce chemical mechanical polishing damage of narrow copper lines | Shwangming Jong, Wen-Chih Chiou | 2004-04-27 |
| 6706577 | Formation of dual gate oxide by two-step wet oxidation | Jih-Churng Twu, Chen-Hua Yu | 2004-03-16 |
| 6689665 | Method of forming an STI feature while avoiding or reducing divot formation | Mo Yu | 2004-02-10 |
| 6686284 | Chemical mechanical polisher equipped with chilled retaining ring and method of using | Chi-Wei Chung, Tung-Ching Tseng, Tsu Shih | 2004-02-03 |
| 6677251 | Method for forming a hydrophilic surface on low-k dielectric insulating layers for improved adhesion | Hsin-Hsien Lu, Aaron Song, Tien-I Bao | 2004-01-13 |
| 6672941 | Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation | Chen-Hua Yu | 2004-01-06 |
| 6657284 | Graded dielectric layer and method for fabrication thereof | Lain-Jong Li, Shwang-Ming Jeng, Chen-Hua Yu | 2003-12-02 |
| 6654109 | System for detecting surface defects in semiconductor wafers | Lain-Jong Li, Chung-Chi Ko | 2003-11-25 |
| 6638328 | Bimodal slurry system | Shen-Nan Lee, Tsu Shih | 2003-10-28 |
| 6634930 | Method and apparatus for preventing metal corrosion during chemical mechanical polishing | Ying-Ho Chen, Wen-Chih Chiou, Tsu Shih, Chia-Ming Yang | 2003-10-21 |
| 6635211 | Reinforced polishing pad for linear chemical mechanical polishing and method for forming | Wen-Chih Chiou, Ying-Ho Chen, Tsu Shih | 2003-10-21 |
| 6623654 | Thin interface layer to improve copper etch stop | Bi-Trong Chen, Lain-Jong Li, Shu E Ku, Tien-I Bao, Lih-Ping Li | 2003-09-23 |
| 6620725 | Reduction of Cu line damage by two-step CMP | Shau-Lin Shue, Ming-Hsing Tsai, Wen-Jye Tsai, Ying-Ho Chen, Tsu Shih +1 more | 2003-09-16 |
| 6620034 | Way to remove Cu line damage after Cu CMP | Tsu Shih, Jih-Churng Jwu, Ying-Ho Chen | 2003-09-16 |
| 6599847 | Sandwich composite dielectric layer yielding improved integrated circuit device reliability | Chen-Hua Yu | 2003-07-29 |
| 6589872 | Use of low-high slurry flow to eliminate copper line damages | Jih-Churng Twu, Ying-Ho Chen, Tsu Shih | 2003-07-08 |
| 6559040 | Process for polishing the top surface of a polysilicon gate | Chen-Hua Yu, Chung-Long Chang | 2003-05-06 |
| 6544891 | Method to eliminate post-CMP copper flake defect | Ying-Ho Chen, Wen-Chih Chiou, Tsu Shih | 2003-04-08 |
| 6541382 | Lining and corner rounding method for shallow trench isolation | Juing-Yi Cheng | 2003-04-01 |