Issued Patents All Time
Showing 76–100 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062997 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Po-Yao Lin, Po-Hao Tsai, Po-Yao Chuang | 2021-07-13 |
| 10971461 | Semiconductor device and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2021-04-06 |
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2020-12-15 |
| 10854563 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2020-12-01 |
| 10797005 | Semiconductor package and method for manufacturing the same | Chen-Shien Chen, Ming-Da Cheng, Yu-Tse Su | 2020-10-06 |
| 10685920 | Semiconductor device package with warpage control structure | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2020-06-16 |
| 10665559 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2020-05-26 |
| 10510734 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-12-17 |
| 10276548 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-04-30 |
| 10008480 | Package-on-package structure with through molding via | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2018-06-26 |
| 9887144 | Ring structure for chip packaging | Wen-Yi Lin, Yu-Chih Liu, Tsung-Shu Lin, Bor-Rung Su, Jing Ruei Lu +1 more | 2018-02-06 |
| 9831190 | Semiconductor device package with warpage control structure | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2017-11-28 |
| 9780076 | Package-on-package structure with through molding via | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2017-10-03 |
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Shu-Shen Yeh, Cheng-Lin Huang, Chin-Hua Wang, Kuang-Chun Lee, Wen-Yi Lin +4 more | 2017-08-29 |
| 9721868 | Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate | Po-Yao Lin, Wen-Yi Lin, Shyue-Ter Leu, Shu-Shen Yeh | 2017-08-01 |
| 9653391 | Semiconductor packaging structure and manufacturing method thereof | Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2017-05-16 |
| 9583474 | Package on packaging structure and methods of making same | Wen-Yi Lin, Jiun Yi Wu, Jing Ruei Lu, Po-Yao Lin | 2017-02-28 |
| 9548281 | Electrical connection for chip scale packaging | Wen-Yi Lin, Fu-Jen Li, Po-Yao Lin | 2017-01-17 |
| 9543284 | 3D packages and methods for forming the same | Fu-Jen Li, Kuo-Chuan Liu, Po-Yao Lin, Wen-Yi Lin | 2017-01-10 |
| 9515038 | Electrical connection for chip scale packaging | Fu-Jen Li, Po-Yao Lin, Chia-Jen Cheng, Hsiu-Mei Yu | 2016-12-06 |
| 9502323 | Method of forming encapsulated semiconductor device package | Wen-Yi Lin, Kuo-Chuan Liu, Po-Yao Lin, Cheng-Yi Hong | 2016-11-22 |
| 9502387 | Package-on-package structure with through molding via | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2016-11-22 |
| 9252076 | 3D packages and methods for forming the same | Wen-Yi Lin, Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2016-02-02 |
| 9237647 | Package-on-package structure with through molding via | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2016-01-12 |
| 9087882 | Electrical connection for chip scale packaging | Fu-Jen Li, Po-Yao Lin, Chia-Jen Cheng, Hsiu-Mei Yu | 2015-07-21 |