MY

Ming-Chih Yew

TSMC: 105 patents #240 of 12,232Top 2%
General Motors: 4 patents #3,733 of 18,328Top 25%
AT Advanced Chip Engineering Technology: 1 patents #20 of 28Top 75%
📍 Hsinchu, MI: #1 of 22 inventorsTop 5%
Overall (All Time): #11,789 of 4,157,543Top 1%
110
Patents All Time

Issued Patents All Time

Showing 101–110 of 110 patents

Patent #TitleCo-InventorsDate
8946888 Package on packaging structure and methods of making same Wen-Yi Lin, Po-Yao Lin, Jing Ruei Lu, Jiun Yi Wu 2015-02-03
8941248 Semiconductor device package and method Wen-Yi Lin, Cheng-Yi Hong, Po-Yao Lin, Kuo-Chuan Liu 2015-01-27
8901732 Semiconductor device package and method Fu-Jen Li, Wen-Yi Lin, Po-Yao Lin, Kuo-Chuan Liu 2014-12-02
8847369 Packaging structures and methods for semiconductor devices Wen-Yi Lin, Jiun Yi Wu, Po-Yao Lin 2014-09-30
8624392 Electrical connection for chip scale packaging Fu-Jen Li, Po-Yao Lin, Chia-Jen Cheng, Hsiu-Mei Yu 2014-01-07
7884464 3D electronic packaging structure having a conductive support substrate Chang Yuan, Chan-Yen Chou, Kou-Ning Chiang 2011-02-08
4781364 Elastic beam-torsion rod connection Bernard J. Finn 1988-11-01
4568096 Automatic vehicle level control Bernard J. Finn, Herbert A. Libkie, Kenneth R. Meloche, James G. McLeish 1986-02-04
4540197 Vehicle wheel suspension Bernard J. Finn 1985-09-10
4377298 Vehicle wheel suspension Bernard J. Finn 1983-03-22