Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7884464 | 3D electronic packaging structure having a conductive support substrate | Ming-Chih Yew, Chang Yuan, Chan-Yen Chou | 2011-02-08 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7884464 | 3D electronic packaging structure having a conductive support substrate | Ming-Chih Yew, Chang Yuan, Chan-Yen Chou | 2011-02-08 |