Issued Patents All Time
Showing 226–250 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269589 | Method of manufacturing a release film as isolation film in package | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2019-04-23 |
| 10269587 | Integrated circuit packages and methods of forming same | Li-Hui Cheng, Po-Hao Tsai | 2019-04-23 |
| 10224293 | Package structure and method for forming the same | Chen-Hua Yu, Tsei-Chung Fu | 2019-03-05 |
| 10204889 | Package structure and method of forming thereof | Po-Hao Tsai | 2019-02-12 |
| 10170295 | Flux residue cleaning system and method | I-Ting Chen, Szu-Wei Lu, Ying-Ching Shih | 2019-01-01 |
| 10170451 | Semiconductor device method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2019-01-01 |
| 10170441 | Semiconductor structure and manufacturing method thereof | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2019-01-01 |
| 10170341 | Release film as isolation film in package | Li-Hui Cheng, Po-Hao Tsai | 2019-01-01 |
| 10163872 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Po-Hao Tsai | 2018-12-25 |
| 10163875 | Method for forming chip package structure with adhesive layer | Li-Hui Cheng, Po-Hao Tsai, Yi-Hang Lin | 2018-12-25 |
| 10163857 | Multi-chip fan out package and methods of forming the same | Chen-Hua Yu, Jui-Pin Hung | 2018-12-25 |
| 10163848 | Semiconductor package | Li-Hui Cheng, Po-Hao Tsai, Chih-Chien Pan | 2018-12-25 |
| 10163706 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Wen-Chih Chiou, Shin-Puu Jeng | 2018-12-25 |
| 10163711 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung | 2018-12-25 |
| 10163813 | Chip package structure including redistribution structure and conductive shielding film | Po-Hao Tsai | 2018-12-25 |
| 10163841 | Multi-chip package and method of formation | Chen-Hua Yu, Jui-Pin Hung, Der-Chyang Yeh | 2018-12-25 |
| 10163817 | Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same | Chen-Hua Yu, Szu-Wei Lu, Yen-Yao Chi | 2018-12-25 |
| 10157888 | Integrated fan-out packages and methods of forming the same | Tsung-Fu Tsai, Chen-Hua Yu, Po-Hao Tsai, Shih-Ting Lin, Szu-Wei Lu +2 more | 2018-12-18 |
| 10157879 | Die-to-die gap control for semiconductor structure and method | Szu-Wei Lu, Ying-Ching Shih, Ying-Da Wang, Li-Chung Kuo, Long Hua Lee +2 more | 2018-12-18 |
| 10157850 | Semiconductor packages and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2018-12-18 |
| 10157870 | Integrated fan-out package and method of fabricating the same | Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2018-12-18 |
| 10153222 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Szu-Wei Lu, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2018-12-11 |
| 10153175 | Metal oxide layered structure and methods of forming the same | Cheng-Lin Huang | 2018-12-11 |
| 10153179 | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking | Shih-Ting Lin, Chen-Hua Yu | 2018-12-11 |
| 10147816 | Semiconductor structure and fabrication method thereof | — | 2018-12-04 |