Issued Patents All Time
Showing 251–275 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141239 | Thermal dissipation through seal rings in 3DIC structure | — | 2018-11-27 |
| 10141253 | Semiconductor device and method | Chi-Hsi Wu, Chen-Hua Yu, Po-Hao Tsai | 2018-11-27 |
| 10134701 | Solder bump for ball grid array | Jung-Hua Chang, Cheng-Lin Huang | 2018-11-20 |
| 10134719 | Semiconductor package and manufacturing method thereof | Li-Hui Cheng, Po-Hao Tsai | 2018-11-20 |
| 10128175 | Packaging methods and packaged semiconductor devices | Jui-Pin Hung | 2018-11-13 |
| 10128140 | System and method for automatically correcting for rotational misalignment of wafers on film frames | — | 2018-11-13 |
| 10128226 | Mechanisms for forming package structure | Po-Hao Tsai | 2018-11-13 |
| 10115653 | Thermal dissipation through seal rings in 3DIC structure | — | 2018-10-30 |
| 10115647 | Non-vertical through-via in package | Cheng-Lin Huang, Jung-Hua Chang, Jy-Jie Gau | 2018-10-30 |
| 10115650 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Szu-Wei Lu | 2018-10-30 |
| 10115675 | Packaged semiconductor device and method of fabricating a packaged semiconductor device | Li-Hui Cheng, Po-Hao Tsai | 2018-10-30 |
| 10109613 | 3DIC stacking device and method of manufacture | Chen-Hua Yu | 2018-10-23 |
| 10109573 | Packaged semiconductor devices and packaging devices and methods | Po-Hao Tsai | 2018-10-23 |
| 10109567 | Fan-out wafer level package structure | — | 2018-10-23 |
| 10103132 | Semiconductor device and method of manufactures | Po-Hao Tsai, Li-Hui Cheng | 2018-10-16 |
| 10103125 | Chip package structure and method for forming the same | Chen-Hua Yu, Po-Hao Tsai, An-Jhih Su | 2018-10-16 |
| 10090253 | Semiconductor package | Po-Hao Tsai, Ying-Ching Shih, Szu-Wei Lu | 2018-10-02 |
| 10083946 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Feng-Cheng Hsu, Li-Hui Cheng, Jui-Pin Hung | 2018-09-25 |
| 10083928 | Metal bump joint structure | — | 2018-09-25 |
| 10083913 | Fan-out POP structure with inconsecutive polymer layer | Yi-Lin Tsai, Jeffrey Chang, Nai-Wei Liu, Tsei-Chung Fu | 2018-09-25 |
| 10079225 | Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package | Jui-Pin Hung, Li-Hui Cheng | 2018-09-18 |
| 10079159 | Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package | Jui-Pin Hung, Li-Hui Cheng | 2018-09-18 |
| 10062662 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung | 2018-08-28 |
| 10049989 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Po-Hao Tsai, Jui-Pin Hung | 2018-08-14 |
| 10049928 | Embedded 3D interposer structure | Ying-Ching Shih, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2018-08-14 |