Issued Patents All Time
Showing 301–325 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847269 | Fan-out packages and methods of forming same | Jeffrey Chang, Chun-Hsing Su, Tsei-Chung Fu, Yi-Chao Mao | 2017-12-19 |
| 9847315 | Packages, packaging methods, and packaged semiconductor devices | Shih-Ting Lin, Szu-Wei Lu, Jui-Pin Hung | 2017-12-19 |
| 9847255 | TSV formation processes using TSV-last approach | Yung-Chi Lin, Ku-Feng Yang | 2017-12-19 |
| 9842826 | Semiconductor device and method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2017-12-12 |
| 9837370 | Bump structures for multi-chip packaging | Chen-Hua Yu | 2017-12-05 |
| 9831224 | Solution for reducing poor contact in info packages | Chen-Hua Yu, Szu-Wei Lu, Shih-Ting Lin, Shin-Puu Jeng | 2017-11-28 |
| 9831156 | Front-to-back bonding with through-substrate via (TSV) | — | 2017-11-28 |
| 9824989 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Cheng-Lin Huang | 2017-11-21 |
| 9818697 | Semiconductor package manufacturing method | Po-Hao Tsai, Ying-Ching Shih, Szu-Wei Lu | 2017-11-14 |
| 9799581 | Integrated fan-out structure with openings in buffer layer | Wu Sen Chiu, Li-Hui Cheng, Po-Hao Tsai | 2017-10-24 |
| 9793187 | 3D packages and methods for forming the same | Shih-Ting Lin, Kung-Chen Yeh, Szu-Wei Lu | 2017-10-17 |
| 9773724 | Semiconductor devices, methods of manufacture thereof, and semiconductor device packages | I-Ting Chen, Ying-Ching Shih, Po-Hao Tsai, Szu-Wei Lu | 2017-09-26 |
| 9768143 | Hybrid bonding with through substrate via (TSV) | — | 2017-09-19 |
| 9761566 | Multi-die structure and method of forming same | Chen-Hua Yu, Po-Hao Tsai, Li-Hui Cheng | 2017-09-12 |
| 9748189 | Multi-chip package structure and method of forming same | Jui-Pin Hung, Chen-Hua Yu, Der-Chyang Yeh | 2017-08-29 |
| 9741689 | 3-D package having plurality of substrates | Chin-Chuan Chang, Chen-Hua Yu | 2017-08-22 |
| 9741693 | Semiconductor package and method of forming the same | Chin-Fu Kao, Tsei-Chung Fu | 2017-08-22 |
| 9728508 | Semiconductor device and method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2017-08-08 |
| 9728496 | Packaged semiconductor devices and packaging devices and methods | Po-Hao Tsai | 2017-08-08 |
| 9711427 | Thermal dissipation through seal rings in 3DIC structure | — | 2017-07-18 |
| 9711472 | Solder bump for ball grid array | Jung-Hua Chang, Cheng-Lin Huang | 2017-07-18 |
| 9711475 | Bump structural designs to minimize package defects | Cheng-Lin Huang | 2017-07-18 |
| 9704783 | Through substrate vias with improved connections | Ku-Feng Yang | 2017-07-11 |
| 9704825 | Chip packages and methods of manufacture thereof | Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2017-07-11 |
| 9698121 | Methods and structures for packaging semiconductor dies | Yi-Chao Mao | 2017-07-04 |