Issued Patents All Time
Showing 26–50 of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854994 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2023-12-26 |
| 11848271 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen, Chen-Hua Yu | 2023-12-19 |
| 11842983 | Semiconductor structure | Chen-Hua Yu, Chi-Hsi Wu, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2023-12-12 |
| 11837587 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Li-Hsien Huang, Po-Hao Tsai +2 more | 2023-12-05 |
| 11823912 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Li-Hsien Huang | 2023-11-21 |
| 11804475 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-10-31 |
| 11742298 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Shin-Puu Jeng, Chen-Hua Yu | 2023-08-29 |
| 11728249 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2023-08-15 |
| 11721559 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Hsien-Wei Chen, Chi-Hsi Wu, An-Jhih Su, Wei-Yu Chen | 2023-08-08 |
| 11715727 | Packages and methods of forming packages | Chen-Hua Yu, An-Jhih Su | 2023-08-01 |
| 11682654 | Semiconductor structure having a sensor device and method of manufacturing the same | Li-Hsien Huang, Ta-Hsuan Lin, Ming-Shih Yeh | 2023-06-20 |
| 11664322 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Wei-Cheng Wu | 2023-05-30 |
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +2 more | 2023-05-16 |
| 11646220 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2023-05-09 |
| 11631611 | Wafer level chip scale packaging intermediate structure apparatus and method | Chen-Hua Yu | 2023-04-18 |
| 11626341 | Package structure | Shih-Hui Wang, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang | 2023-04-11 |
| 11626296 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Hsien-Wei Chen, Wei-Yu Chen | 2023-04-11 |
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Wei Chen, Li-Han Hsu +1 more | 2023-03-21 |
| 11594520 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-02-28 |
| 11587900 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su +1 more | 2023-02-21 |
| 11581250 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shuo-Mao Chen, Chiung-Han Yeh | 2023-02-14 |
| 11532567 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Jie Chen | 2022-12-20 |
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Cheng-Hsien Hsieh, Li-Han Hsu +3 more | 2022-11-29 |
| 11508695 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +1 more | 2022-11-22 |
| 11502032 | Chip package and method of fabricating the same | Guan-Yu Chen, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2022-11-15 |