Issued Patents All Time
Showing 51–75 of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482497 | Package structure including a first die and a second die and a bridge die and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su +2 more | 2022-10-25 |
| 11470720 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Wei Chen, Li-Han Hsu +1 more | 2022-10-11 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Ming-Shih Yeh +1 more | 2022-10-11 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2022-10-11 |
| 11450612 | Semiconductor devices and methods of manufacturing the same | Yu-Hung Lin, An-Jhih Su, Shih-Guo Shen, Chia-Nan Yuan, Ming-Shih Yeh | 2022-09-20 |
| 11444057 | Package structures and methods of forming | Chen-Hua Yu, Hsien-Wei Chen | 2022-09-13 |
| 11444034 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2022-09-13 |
| 11444020 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu +1 more | 2022-09-13 |
| 11430670 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Li-Hsien Huang | 2022-08-30 |
| 11424189 | Pad structure design in fan-out package | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen | 2022-08-23 |
| 11373969 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Hsien-Wei Chen, Jie Chen | 2022-06-28 |
| 11355468 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu | 2022-06-07 |
| 11342196 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, An-Jhih Su, Wei-Yu Chen | 2022-05-24 |
| 11335658 | Multi-chip package and method of formation | Jing-Cheng Lin, Chen-Hua Yu, Jui-Pin Hung | 2022-05-17 |
| 11289398 | Package structure and manufacturing method thereof | Shih-Hui Wang, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang | 2022-03-29 |
| 11251071 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2022-02-15 |
| 11217570 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Li-Hsien Huang, Po-Hao Tsai +2 more | 2022-01-04 |
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Li-Hsien Huang, Chi-Hsi Wu, Chen-Hua Yu, Hua-Wei Tseng, Ming-Chih Yew +2 more | 2021-12-14 |
| 11189603 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Han-Ping Pu | 2021-11-30 |
| 11177142 | Method for dicing integrated fan-out packages without seal rings | Li-Hsien Huang, Yueh-Ting Lin, An-Jhih Su, Ming-Shih Yeh | 2021-11-16 |
| 11177238 | Semiconductor structure | Chen-Hua Yu, Chi-Hsi Wu, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2021-11-16 |
| 11158619 | Redistribution layers in semiconductor packages and methods of forming same | Li-Hsien Huang, An-Jhih Su, Chi-Hsi Wu, Chen-Hua Yu | 2021-10-26 |
| 11152323 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Hsien-Wei Chen +2 more | 2021-10-19 |
| 11133258 | Package with bridge die for interconnection and method forming same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Tsung-Shu Lin | 2021-09-28 |
| 11094680 | Packages and methods of forming packages | Chen-Hua Yu, An-Jhih Su | 2021-08-17 |